OPC FLET COPPER

• High connecting reliability with inner copper foil and plated copper
  Can obtain copper film with small thickness stably
  Great deposition performance into via-, through-holes
  High adhesion power on low Ra materials, prevent blisters
  High purity copper is available
  Low sheet resistance is possible even by small thickness
• Electroless Copper Plating Solution
• Printed Wiring Board

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  「OPC FLET PROCESS」
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• Total process solutions