通知NEWS

2026.09.24表面处理展示会

台灣奧野股份有限公司参加了SEMICON SEMICON Taiwan 2026展会

台灣奧野股份有限公司于2026年9月2日（星期三）至4日（星期五）参加了SEMICON Taiwan 2026 展会。
我们介绍了面向半导体晶圆和玻璃芯基板的最新表面处理药品及工艺。
如需了解更多信息，请通过网站上的咨询表联系我们。

semicon_taiwan_2026_booth

展览会地点

台北南港展覽館(TaiNEX)（台灣）

内容

Surface finishing technology to glass substrates

  • Highly adhesive plating process on glass
  • Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for semiconductor wafer

  • Acid copper plating additives for semiconductor wafer
  • Acid copper plating additive for Cu-Cu hybrid bonding
  • UBM formation on aluminum electrode on wafer
  • Electroless plating equipment for wafer to make UBM

Plating technology for IC substrate

  • Acid copper plating additive for high-current density, fine pattern via filling
  • Acid copper plating additive for large diameter via filling
  • Electroless plating process for insulated heat dissipation substrate (for power modules)
  • Highly-reliable granular copper plating technology with high adhesion to molding materials

返回