通知NEWS

2026.05.14表面处理展示会

我们将参加 "JPCA Show 2026"

本公司将于2026年6月10日(星期三)～12日(星期五)在东京BIG SIGHT举办的"JPCA Show 2026"。
以对印刷基板/半导体封装基板的发展做出贡献的OKUNO的制品为主题，将介绍展台将展示用于晶片，封装基板，印刷电路板，FPC 和动力模块的最新表面处理化学品和工艺技术。 我们期待您的光临。
到场需要提前登记。如果事先登记到场的话，入场费是免费的。详情请参见本展示会的官方网站。

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日期和时间

2026年6月10日(星期三)～12日(星期五)

展览会地点

东京BIG SIGHT,東2展厅【2C-65】

内容
Plating technology for glass substrate
  • Highly adhesive plating process on glass
  • Acid copper plating additive for through-hole filling to glass core substrates
Plating technology for packaging substrate
  • Electroless copper plating process for next-generation semiconductor packaging
  • Acid copper plating additive for high-current density, fine pattern via filling
  • Acid copper plating additive for large diameter via filling
  • Electroless Ni/Pd/Au plating process for high joint reliability for packaging substrate
Plating technology for PCB
  • Acid copper plating additive for MSAP for via-filling and through-hole plating
  • Acid copper plating additive to high aspecto ratio
  • Electroless Ni/Au plating process for high joint reliability for FPC and rigid PWB
Plating technology for semiconductor wafer
  • UBM formation on aluminum electrode on wafer
  • Acid copper plating additive for semiconductor wafer
  • Acid copper plating additive for Cu-Cu hybrid bonding
Plating technology for sintered substrate
  • Electroless plating process for insulated heat dissipation substrate for power module
  • Electroless Ni-B plating process for sintered conductive circuits on ceramic substrates

NPI presentation

  • Time：2026/6/11 (Thu.)　12:15 to 12:35
  • Place：Tokyo Big Sight East Hall3 Seminar room 6
  • Title：Highly-adhesive seed layer formation for electroless copper plating process on glass

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URL
https://www.jpcashow.com/show2026/en/index.html

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