2025.11.13表面处理展示会
台灣奧野股份有限公司參加了"TPCA Show 2025"
台灣奧野股份有限公司於2025年10月22日(星期三)至10月24日(星期五)參加了在台灣台北南港展覧館(TaiNEX)舉辦的"TPCA Show 2025"。
展會期間，台灣奧野展出了最新的半導體晶圓及玻璃基板表面處理藥品與製程技術。
詳情請確認的"咨询"。
- 内容
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Surface finishing technology to glass core substrares
- Highly adhesive plating process on glass
- Acid copper plating additive for through-hole filling to glass core substrates
Plating technology for wafer and power modules
- UBM formation on aluminum electrode on wafer
- Acid copper plating additive to silicon interposer for high aspect ratio filling
- Acid copper plating additive to micro bump and trench filling
- Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
- Acid copper plating additive for ultra-fine pattern formation
- Acid copper plating additive for Cu-Cu hybrid bonding
- Electroless plating process for insulated heat dissipation substrate (for power modules)
The latest surface finish for IC substrates
- Electroless copper plating process to solve Weak-Micro Via for high connection reliability
- Acid copper plating additive for high-current density, fine pattern via filling
- Acid copper plating additive for large diameter vias
The latest surface finishing for FPCs
- For fine pattern formation, high joint reliability electroless nickel/gold plating process
- Acid copper plating additive for high aspect ratio