通知NEWS

2023.11.02表面处理无机材料展示会

我们参加了 ''TPCA Show 2023"。感谢您来参加。

本公司参加了2023年10月25日(星期三)～10月27日(星期五)在台北南港展覽館举办的"TPCA Show 2023"。 感谢您来参加。如需更多信息、请使用网站的咨询形式。

tpca_show_booth

日期和时间

2023年10月25日(星期三)～10月27日(星期五)

展览会地点

台北南港展覽館

内容

Plating technology for wafer

  • Acid copper plating additives
    Additive for acid copper plating for TSV filling
    Additive for acid copper plating for Cu pillar formation
    Additive for acid copper plating for low aspect ratio via and trench filling
  • Electroless copper plating process ensuring high adhesion for glass substrates
  • UBM (Under Barrier Metallization) process for Al electrode on wafer

The latest surface finish for IC substrates

  • Electroless Cu plating process for high connection reliability
  • Additive for acid copper plating for high thickness uniformity and via filling
  • Palladium residue remover applicable to fine patterns
  • Electroless Ni/Au process using reduced cobalt catalyzing solution

The latest surface finish for PWB

  • Additive for acid copper plating with high via-filling performance to large diameter holes

The latest surface finish for FPC

  • Electroless Cu plating process to LCP films for high-frequency and high-speed transmission
  • Additive for acid copper plating applicable to horizontal Roll to Roll plating equipment
  • Electroless Ni/Au process for ultra-fine pattern formation

The latest surface finish for power modules

  • Electroless plating process to dielectronic substrates for power modules

Glass materials for electronic components

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