- Electronics
- Printed Wiring Board
- Direct Acid Copper Plating Process
- 筛选:
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- Use for PWB stock tanks in DYLEX PROCESS
Use when PWB are kept for a long time before acid copper plating
- Conductive Film Stabilizer
- Printed Wiring Board
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- Clean conductive films in holes
Promote deposition performance of copper electroplating
Remove conductive films from copper foils
Increase adhesion
- Neutralizer
- Printed Wiring Board
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- Reduct conducting agents in holes
Enable copper electroplating
- Conductivity Inducer
- Printed Wiring Board
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- Use for conducting in DYLEX PROCESS
Great adsorption performance
Cover inside of holes completely
- Conducting Agent
- Printed Wiring Board
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- Great peameability
Give high wettability into holes
Increase the adsorption of conducting agents
- Surface Conditioner
- Printed Wiring Board
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- For DYLEX PROCESS as cleaner and conditioner
Remove dirt from boards, promote the adsorption of conducting agents
- Conditioner
- Printed Wiring Board
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- For DYLEX PROCESS
Use for cleaning and activating steps before acid copper plating
Use when substrates are dried before electro-copper plating
- Acidic Cleaner
- Printed Wiring Board
