NPG FLASH GOLD SSR

• Immersion-reduction type, electroless Au plating solution
  Excellent in solder wetting, high solder-joint strength, and superior gold wire-bonding performance
  Ideal for electroless nickel/palladium/gold processes
• Electroless Ni-P/Pd/Au Plating Process
  
  Electroless Gold Plating Solution
• Printed Wiring Board