ICP NICORON HBR

• Electroless Ni plating solution for electroless Ni/Pd/Au process
  Excellent in solder wettability, solder-joint strength, superior Au wire-bonding performance
  Fine pattern formation is possible
• Electroless Ni-P/Pd/Au Plating Process
  
  Electroless Nickel Plating Solution
• Printed Wiring Board