TORYZA SG TK

• Excellent in gold wire bonding performance
  Bath pH is neutral, can use for the substrates that are weak to acid and alkali
  Deposition speed is approx. 0.6 to 0.8 μm/h
  Easy wastewater treatment, not containing cyanide compounds
  High resistance against nickel impurities
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Gold Plating Solution
• Aluminum alloy, Wafer, Copper alloy

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• Total process solutions