TOP LUCINA GCS TF

• Acid copper plating additive for through-hole filling to glass core subustates
  Ideal for high aspect ratio through-hole filling plating
  Strongly suppress the deposition near hole opening and prevent voids
  Additive performance is stable, realize high-quality plating
• For Through-hole Filling Plating
• Printed Wiring Board, Glass

Unknown: file_get_contents(): Passing null to parameter #2 ($use_include_path) of type bool is deprecated in /home/hkpallu2/public_html/www.ch-okuno.com/application/src/extensions/htmlExtension.php on line 277

• Learn more about featured products
  「TOP LUCINA GCS series」