TOP LUCINA GCS PR

• Acid copper plating additive for through-hole filling for glass core substrates
  It fills the inside of the hole with copper using a plating bath for PR pulse electrolysis,
  while suppressing the generation of voids using a next filling plating process.
  It maintains a lustrous appearance over a wide range of electrolytic conditions. even when using PR pulse electrolysys.
• For Through-hole Filling Plating
• Printed Wiring Board, Glass

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