TORYZA FG SR

• Immersion-reduction type electroless gold plating solution
  Prevent the corrosion of the underlying nickel plating films
  For low phosphorus and medium phosphorus type electroless Ni-P plating
  Dense plating films is obtained over nickel and palladium plating films
  High solder wettability and solder joint strength, excellent in gold wire bondability
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Gold Plating Solution
• Wafer

Unknown: file_get_contents(): Passing null to parameter #2 ($use_include_path) of type bool is deprecated in /home/hkpallu2/public_html/www.ch-okuno.com/application/src/extensions/htmlExtension.php on line 277
Warning: file_get_contents(https://www.ch-okuno.com/product/feature/toryza_el_process.html): Failed to open stream: HTTP request failed! HTTP/1.1 404 Not Found in /home/hkpallu2/public_html/www.ch-okuno.com/application/src/extensions/htmlExtension.php on line 277