TORYZA NCR HRC

• Sulfur-free, low phosphorus type (P content: 1.5 to 2.5 % by weight) electroless Ni-P plating solution
  Suitable for power semiconductors that require high temperature bonding and regular use at high temperatures.
  Excellent crack resistance and less film embrittlement even after heat treatment over 400°C
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Nickel Plating Solution
• Wafer

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