TORYZA NCR MLP

• Sulfur-free low phosphorus type electroless nickel solution
  For power semiconductors that require high-temperature bonding
  For power semiconductors that are used at high temperatures
  Excellent crack resistance even after heat treatment at 300 to 350°C
  Minimal degradation of solder wettability over time
  (P content:2-3wt%)
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Nickel Plating Solution
• Wafer

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