OPC COPASEED SCP

• Copper paste for plating seed layer by screen printing
  Can use by low-temperature curing in air
  Excellent in deposition of electroless plating
  Achieve high adhesion between substrates and plating films
• Catalyzing Agent
• General plastics, Polyethylene terephthalate(PET), Polyimide(PI)

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  「OPC COPASEED SCP」