ICP NICORON FPF-TM

• High folding endurance
  Deposition rate 12μm/h (P content: 7 to 11% by weight)
  Prevent blackening and corrosion after stripping immersion gold plating
  Excellent in solder wet and solder joint performance
  Fine pattern and semi-bright appearance can be obtained
• Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
• Printed Wiring Board

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• Total process solutions