FLASH GOLD 330S

• High solder wettability, solder joint strength
  Reduce damage to base nickel films
  Fine and uniform deposition
  Deposition rate: 0.085μm/10min (at 84℃)
  
• Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
• Printed Wiring Board

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• Total process solutions