OPC H-TEC CONDICLEAN WA-1

• Promote catalyst adsorption on hole wall, resin, glass fiber
  Can omit anionic pre-dipping step
  High connection reliability with inner copper foils
  Prevent foaming by agitation or bath circulation
• Conditioner
• Printed Wiring Board

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  「OPC H-TEC PROCESS NEX」
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• Total process solutions