OPC MUDENGOLD 25

• Electroless gold plating solution
  Alkaline-, reduction-type
  Deposition rate 5μm/h, excellent in gold-wire bonding performance
• Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
• Ceramics

Unknown: file_get_contents(): Passing null to parameter #2 ($use_include_path) of type bool is deprecated in /home/hkpallu2/public_html/www.ch-okuno.com/application/src/extensions/htmlExtension.php on line 306

• Total process solutions