FLASH GOLD 330

• Reduce damage to nickel films
  Fine and uniform film appearance can be obtained
  High solder wettability and solder joint strength
  Can use at a low temperature (0.06μm/10min at 80℃)
• Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
• Printed Wiring Board

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• Total process solutions