PALLATOP LP

• Auto-catalytic type electroless palladium plating solution
  Palladium purity over 99％ (P content below 1%) is possible
  Great bath stability, tolerant against dragged-in impurities
  High solder-joint and heat-resistant gold wire bonding performance can be obtained after immersion gold plating on PALLATOP LP film
  Neutral bath, reduce damage to substrates
  Cyanide-free products
• Electroless Ni-P/Pd/Au Plating Process
  
  Electroless Palladium Plating Solution
• Printed Wiring Board

Unknown: file_get_contents(): Passing null to parameter #2 ($use_include_path) of type bool is deprecated in /home/hkpallu2/public_html/www.ch-okuno.com/application/src/extensions/htmlExtension.php on line 306

• Total process solutions