NPG FLASH GOLD SR

• High solder wettability, solder joint strength and gold wire bonding performance
  Best product for electroless Ni-P/Pd/Au process
  Stable deposition performance, can obtain uniform deposits on palladium films
  High deposition performance (0.1μm/25min, on 0.1μm of palladium film)
  Prevent base film corrosion
• Electroless Ni-P/Pd/Au Plating Process
  
  Electroless Gold Plating Solution
• Printed Wiring Board

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• Total process solutions