TOP SILVE ACC

• Immersion-type electroless silver plating solution for copper
  Acidic bath, deposition rate 0.2μm/15min
  No voids between copper and silver
  Can obtain high adhesion silver films
  High bath stability
• Electroless (Ni-P)/(Pd)/Ag Plating Process
  
  Electroless Silver Plating Solution
• Copper alloy, Printed Wiring Board