OPC H-TEC COPPER

• Use for electroless copper plating by horizontal conveyance system
  Cyanide-free, rochelle salt based product
  Can show high deposition performance quickly
  High bath stability, not cause bristers on low surface roughness substrates
• Electroless Copper Plating Solution
• Printed Wiring Board

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  「OPC H-TEC PROCESS NEX」
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• Total process solutions