TOP LUCINA VT

• Acid copper plating additive for via-filling and through hole plating
  Can realize high throwing power and great via-filling performance at the same time
  High ductility, bright appearances, great thermal-shock resistance come available
  Applicable to subtractive costruction method and M-SAP
• For Via-filling Plating
• Printed Wiring Board

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  「TOP LUCINA VT」