TOP RIP PBF

• Use for copper alloys, iron-nickel alloys
  Can peel lead-free (Sn-Bi, Sn-Cu, Sn-Ag）solder plating films
  Strongly protect substrates from encroachment
  Excellent in appearances after peeling
  Hydrogen-peroxide free, halogen-free
• For Tin/Tin Alloy Plating Films (For Dipping)
• Copper alloy, 42Alloy