OPC COPPER MIC-BL

• Electroless copper plating solution for MID
  Cyanide-free, EDTA-based product
  High bath stability, high speed plating is possible (5μm/h)
  High selectivity to copper
• Electroless Plating Process Chemical for MID
  
  Electroless Copper Plating Solution
• Printed Wiring Board, Molded interconnect device(MID)