TOTAL
PROCESS
全部工艺

奥野制药工业的表面处理药品,无机材料广泛应用于智能手机,半导体,电子部件,汽车,机械部件等。
如果是印刷线路板,阳极氧化(anodizing),塑料电镀,无电解镀,电镀等表面处理的话,都可以交给我们。
奥野制药工业可以提供从试作到批量生产,表面处理上全方位的技术支持。

  • Electroless plating process applicable to UBM formation for aluminum electrodes on wafers

    Electroless plating process applicable to UBM formation for aluminum electrodes on wafers

    • Electroless plating process applicable to UBM formation for aluminum electrodes on wafers
    • We have developed the "TORYZA EL PROCESS", a plating process for forming UBM for aluminum electrodes on wafers. We can provide a variety of plating chemicals and solutions for semiconductor industries.
    • Si wafer, SiC wafer

    前往详细页面

  • OKUNO's process for the manufacture of semiconductor package substrates

    OKUNO's process for the manufacture of semiconductor package substrates

    • We provide many plating chemicals from pre-treatment to post-treatment for the manufacturing of IC substrates and interposers by semi additive process (SAP).
    • IC substrates, plastic semiconductor substrates, plastic interposers for CPU, GPU and other semiconductor devices
    • Build-up printed wiring boards

    前往详细页面

  •  Electroless plating process for Direct Copper Bonding (DCB) dielectric ceramic substrates

    Electroless plating process for Direct Copper Bonding (DCB) dielectric ceramic substrates

    • We offer a wide range of processing chemicals, primarily focusing on plating solutions for Direct Copper Bonding (DCB) dielectric ceramic substrates, which feature high thermal conductivity and electrical conductivity on ceramics.
    • Heat radiating dielectric ceramic substrates
    • Ceramic substrate, AlN (Aluminum Nitride)substrate

    前往详细页面

  • Electroless plating process for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates

    Electroless plating process for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates

    • We offer a wide range of processing chemicals, primarily focusing on plating solutions for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates, which feature high heat radiation property.
    • Heat radiating dielectric ceramic substrates
    • Ceramic substrate, AlN (Aluminum Nitride)substrate

    前往详细页面

  • Anodizing and dyeing process for aluminum surface and color designs

    Anodizing and dyeing process for aluminum surface and color designs

    • We provide our customers all of aluminum-related chemicals from pre-treatment to post-treatment as a total process to create new added value for aluminum.
    • Smartphones, computers, music player, cameras
    • Aluminum alloys

    前往详细页面

  • Contribute PWB(PCB) fabrication by OKUNO’s total solutions

    Contribute PWB(PCB) fabrication by OKUNO’s total solutions

    • We have wide product line-up, mainly for plating process to PWB/PCBs from pre-treatment to post-treatment.
    • Consumer electronics
    • CCL; Copper Clad Laminate

    前往详细页面

  • Decorative plating process for plastic

    Decorative plating process for plastic

    • You will find plastic on plastic technology around us that realizes metallic, beautiful and luxurious feelings on plastic parts. It is widely used for the designs of motorcycle, bicycle, bathroom, interior parts, faucet fittings and many home appliances.
    • Motorcycle, bicycle, bathroom, interior parts, faucet fittings and many home appliances
    • ABS, PC/ABS

    前往详细页面