Electroless plating process applicable to UBM formation for aluminum electrodes on wafers
Electroless plating process applicable to UBM formation for aluminum electrodes on wafers
We have developed the "TORYZA EL PROCESS", a plating process for forming UBM for aluminum electrodes on wafers. We can provide a variety of plating chemicals and solutions for semiconductor industries.
OKUNO's process for the manufacture of semiconductor package substrates
We provide many plating chemicals from pre-treatment to post-treatment for the manufacturing of IC substrates and interposers by semi additive process (SAP).
IC substrates, plastic semiconductor substrates, plastic interposers for CPU, GPU and other semiconductor devices
Electroless plating process for Direct Copper Bonding (DCB) dielectric ceramic substrates
We offer a wide range of processing chemicals, primarily focusing on plating solutions for Direct Copper Bonding (DCB) dielectric ceramic substrates, which feature high thermal conductivity and electrical conductivity on ceramics.
Electroless plating process for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates
We offer a wide range of processing chemicals, primarily focusing on plating solutions for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates, which feature high heat radiation property.
Anodizing and dyeing process for aluminum surface and color designs
We provide our customers all of aluminum-related chemicals from pre-treatment to post-treatment as a total process to create new added value for aluminum.
You will find plastic on plastic technology around us that realizes metallic, beautiful and luxurious feelings on plastic parts. It is widely used for the designs of motorcycle, bicycle, bathroom, interior parts, faucet fittings and many home appliances.
Motorcycle, bicycle, bathroom, interior parts, faucet fittings and many home appliances