2023.09.25表面处理无机材料展示会

我们将参加 "TPCA Show 2023"在台湾。

本公司将于2023年10月25日(星期三)～10月27日(星期五)在台北南港展覽館举办的"TPCA Show 2023"。
以对印刷基板/半导体封装基板的发展做出贡献的OKUNO的制品为主题，将介绍关于Glass Interposer・半导体晶圆・封装基板的药水和工艺，RDL（再配线）形成技术，Power device的最新表面处理等。
详情请参见本展示会的官方网站。

日期和时间

十月二十五日（星期三）到 十月二十七日（星期五）

展览会地点

台北南港展覽館1館

内容

Plating technology for wafer

• Acid copper plating additives
  Additive for acid copper plating for TSV filling
  Additive for acid copper plating for Cu pillar formation
  Additive for acid copper plating for low aspect ratio via and trench filling
• Electroless copper plating process ensuring high adhesion for glass substrates
• UBM (Under Barrier Metallization) process for Al electrode on wafer

The latest surface finish for IC substrates

• Electroless Cu plating process for high connection reliability
• Additive for acid copper plating for high thickness uniformity and via filling
• Palladium residue remover applicable to fine patterns
• Electroless Ni/Au process using reduced cobalt catalyzing solution

The latest surface finish for PWB

• Additive for acid copper plating with high via-filling performance to large diameter holes

The latest surface finish for FPC

• Electroless Cu plating process to LCP films for high-frequency and high-speed transmission
• Additive for acid copper plating applicable to horizontal Roll to Roll plating equipment
• Electroless Ni/Au process for ultra-fine pattern formation

The latest surface finish for power modules

• Electroless plating process to dielectronic substrates for power modules

Glass materials for electronic components

URL

https://tw.tpcashow.com/